Open AccessReliability Analysis of Ring Mold Granulator based on Minimum Maintenance Model
Author(s) -
Risu Na
Publication year - 2019
Language(s) - English
DOI - 10.23940/ijpe.19.07.p12.18601867
Subject(s) - reliability engineering , mold , reliability (semiconductor) , ring (chemistry) , computer science , engineering , materials science , composite material , chemistry , power (physics) , physics , quantum mechanics , organic chemistry