Open AccessForce and amount of resin composite paste used in direct and indirect bonding
Author(s) -
Takeshi Muguruma,
Yoshitaka Yasuda,
Masahiro Iijima,
Naohisa Kohda,
Itaru Mizoguchi
Publication year - 2010
Publication title -
the angle orthodontist
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.116
H-Index - 86
eISSN - 1945-7103
pISSN - 0003-3219
DOI - 10.2319/031910-41.1
Subject(s) - composite number , composite material , materials science , adhesive , bonding strength , direct bonding , bracket , resin composite , layer (electronics) , structural engineering , metallurgy , silicon , engineering
To investigate the relationship between the forces applied by the operator and the amount of adhesive used in the direct and indirect bonding methods.