Open AccessA new fractional thermal model for the Cu/Low-k interconnects in nanometer integrated circuit
Author(s) -
Peiling Zhang,
KangJia Wang
Publication year - 2022
Publication title -
thermal science/thermal science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.339
H-Index - 43
eISSN - 2334-7163
pISSN - 0354-9836
DOI - 10.2298/tsci2203413z
Subject(s) - fractal , nanometre , nanoscopic scale , materials science , integrated circuit , scale (ratio) , derivative (finance) , thermal , heat equation , optoelectronics , nanotechnology , thermodynamics , physics , mathematical analysis , mathematics , quantum mechanics , composite material , financial economics , economics