Open AccessTheoretical calculation and simulation of surface-modified scalable silicon heat sink for electronics cooling
Author(s) -
Yichi Zhang,
Shinichi Saito,
Yoshishige Tsuchiya,
Yeliang Wang
Publication year - 2021
Publication title -
thermal science/thermal science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.339
H-Index - 43
eISSN - 2334-7163
pISSN - 0354-9836
DOI - 10.2298/tsci2106181z
Subject(s) - heat sink , materials science , multiphysics , fin , heat transfer , thermal resistance , mechanics , microfabrication , silicon , electronics cooling , computational fluid dynamics , thermal , volumetric flow rate , mechanical engineering , thermodynamics , finite element method , composite material , optoelectronics , physics , fabrication , engineering , medicine , alternative medicine , pathology
A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estimation of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm ? 1 cm ? 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resistance of 6.84?C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.