Open AccessThermal optimization of a 3-D integrated circuit
Author(s) -
KangJia Wang,
Chu-Xia Hua,
Yan-Hong Liang
Publication year - 2020
Publication title -
thermal science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.339
H-Index - 43
eISSN - 2334-7163
pISSN - 0354-9836
DOI - 10.2298/tsci2004615w
Subject(s) - thermal , distribution (mathematics) , computer science , optimal design , integrated circuit , materials science , mathematical optimization , thermodynamics , mathematics , physics , mathematical analysis , machine learning , operating system
In a 3-D integrated circuit the heat source distribution has a huge effect on the temperature distribution, so an optimal heat source distribution is needed. This paper gives a numerical approach to its thermal optimization, the result can be used for 3-D integrated circuit optimal design.
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