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Experimental investigation of critical heat flux on SiO2 thin film deposited copper substrate in DI water at atmospheric pressure
Author(s) -
T. Nithyanandam,
Senthil Duraisamy
Publication year - 2019
Publication title -
thermal science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.339
H-Index - 43
eISSN - 2334-7163
pISSN - 0354-9836
DOI - 10.2298/tsci190413434t
Subject(s) - materials science , nucleate boiling , wetting , critical heat flux , substrate (aquarium) , coating , thin film , composite material , heat flux , copper , contact angle , boiling , heat transfer , heat transfer coefficient , metallurgy , thermodynamics , nanotechnology , oceanography , physics , geology

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