Open AccessAnneal hardening effect in sintered copper alloys
Author(s) -
Svetlaestorović,
Boran Milicevic,
Darka Marković
Publication year - 2002
Publication title -
science of sintering/science of sintering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.309
H-Index - 25
eISSN - 1820-7413
pISSN - 0350-820X
DOI - 10.2298/sos0202169n
Subject(s) - materials science , copper , metallurgy , recrystallization (geology) , hardening (computing) , electrical resistivity and conductivity , annealing (glass) , atmospheric temperature range , composite material , thermodynamics , paleontology , physics , layer (electronics) , electrical engineering , biology , engineering
Samples of copper and copper alloys CuNi and CuNiAl were prepared by a powder metallurgical method and were then subjected to cold rolling with different degrees of deformation. Copper and copper alloys in the cold-rolled state were isochronally annealed up to the recrystallization temperature during which hardness and electrical conductivity were measured. This investigation shows that the anneal hardening effect occurs in a temperature range of 450 - 650 K, followed with an increase in hardness of alloys