Open AccessThermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys
Author(s) -
G. Garzeł,
M. Kopyto,
L. Zabdyr
Publication year - 2014
Publication title -
journal of mining and metallurgy. section b, metallurgy/journal of mining and metallurgy. section b, metallurgy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.42
H-Index - 20
eISSN - 2217-7175
pISSN - 1450-5339
DOI - 10.2298/jmmb130727015g
Subject(s) - materials science , thermodynamics , tin , ternary operation , metallurgy , physics , computer science , programming language
The electromotive force measurement method was employed to determine the thermodynamic properties of liquid Ag-Bi-Cu-Sn alloys using solid electrolyte galvanic cells as shown below: Kanthal+Re, Ag-Bi-Cu-Sn, SnO2 | Yttria Stabilized Zirconia | air, Pt, Experiments were made within temperature interval: 950 - 1300K along four composition paths of constant ratios: XAg : XBi : XCu = 1, XAg : (XBi + XCu) = 3:2 for XBi = XCu, XBi : (XAg + XCu) = 3:2 for XAg = XCu and XCu : (XAg + XBi) = 3:2 for XAg = XBi and tin concentration changing from 0.1 to 0.9 mole fractions, every 0.1. Almost all the results were approximated by straight line equations: EMF vs T, and tin activities were then calculated in arbitrary temperature; measurement results were presented by graphs. Unusual activity plot for XBi : (XAg + XCu) = 3:2 composition path was most probably caused by miscibility gap detected earlier in Bi-Cu-Sn ternary liquid alloys