Open AccessDevelopment of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders
Author(s) -
Ikuo Ohnuma,
Ryosuke Kainuma,
K. Ishida
Publication year - 2012
Publication title -
journal of mining and metallurgy. section b, metallurgy/journal of mining and metallurgy. section b, metallurgy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.42
H-Index - 20
eISSN - 2217-7175
pISSN - 1450-5339
DOI - 10.2298/jmmb121123052o
Subject(s) - materials science , liquidus , intermetallic , alloy , eutectic system , differential scanning calorimetry , exothermic reaction , phase (matter) , endothermic process , melting point , sintering , metallurgy , chemical engineering , thermodynamics , composite material , chemistry , adsorption , physics , organic chemistry , engineering
TLPS (Transient Liquid Phase Sintering) process is a candidate method of heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the molten Sn-Bi reacts rapidly with solid Ag particles, which results in the formation of heat-resistant intermetallic compound (IMC). In this study, the TLPS properties between Sn-17Bi-1Ag (at.%) powder with its liquidus temperature of 200°C and pure Ag powder were investigated. During differential scanning calorimetry (DSC) measurement, an exothermic reaction and an endothermic reaction occurred, which correspond to the formation of the e-Ag3Sn IMC phase and the melting of the Sn-17Bi-1Ag alloy, respectively. After the overall measurement, the obtained reactant consists of the Ag3Sn-IMC and Bi-rich phases, both of which start melting above 250°C, with a small amount of the residual Sn-Bi eutectic phase. These results suggest that the TLPS process can be applied for Pb-free heatresistant bonding