Open AccessNovel trends in electrocatalysis: Extended Brewer hypo-hyper-d-interionic bonding theory and selective interactive grafting of composite bifunctional electrocatalysts for simultaneous anodic hydrogen
Author(s) -
Stylianos G. Neophytides,
Spiridon Zafeiratos,
Milan M. Jakšić
Publication year - 2003
Publication title -
hemijska industrija
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.147
H-Index - 19
eISSN - 2217-7426
pISSN - 0367-598X
DOI - 10.2298/hemind0309368n
Subject(s) - bifunctional , electrocatalyst , ionic bonding , intermetallic , anode , hydrogen bond , chemistry , x ray photoelectron spectroscopy , inorganic chemistry , materials science , electrode , electrochemistry , chemical engineering , catalysis , molecule , composite material , ion , organic chemistry , alloy , engineering
Novel Trends in Electrocatalysis: Extended Brewer Hypo-Hyper-d-lnterionic Bonding Theory and Selective Interactive Grafting of Composite Bifunctional Electrocatalysts for Simultaneous Anodic Hydrogen and CO OxidationThe Extended Brewer Interactive Interionic Bonding Theory (EBIIBT) has been developed to show the equivalence of interatomic and interionic bonding features, and for their mutual combinations, as well as its effect upon electrocatalytic properties for the hydrogen electrode reactions (HELR). The equivalence of interionic hypo-hyper-d-interelectronic interaction in both metallic and any other ionic state and its effect upon electrocatalytic properties for hydrogen electrode reactions (HELR) has been proved and inferred. TG (Thermal Gravimetry) analysis of TPR (Temperature Programmed Reduction) of mixed hypc-hyper-d-electronic oxides of transition elements was broadly employed to prove the EBIIBT effect as reflected in dramatically decreased individual temperatures of their mutual reduction into intermetallic phases. The same interionic Brewer (and/or intermetallic) bonding effect has been confirmed both by UPD of hyper-d-upon hypo-d-electronic substrates and vice versa, and by the shift of bonding peaks in XPS analysis