
Analysis of Electronic Cooling with Natural Convection and Radiation
Author(s) -
P. Siva Naga Sree
Publication year - 2022
Publication title -
international journal for research in applied science and engineering technology
Language(s) - English
Resource type - Journals
ISSN - 2321-9653
DOI - 10.22214/ijraset.2022.44867
Subject(s) - chip , laminar flow , mechanics , natural convection , heat transfer , materials science , forced convection , aluminium , computer science , physics , telecommunications , metallurgy