Open AccessBiscuit Thickness Validation (HPDC)
Author(s) -
Bharat K. Sharma
Publication year - 2021
Publication title -
international journal for research in applied science and engineering technology
Language(s) - English
Resource type - Journals
ISSN - 2321-9653
DOI - 10.22214/ijraset.2021.39159
Subject(s) - die casting , casting , plunger , materials science , die (integrated circuit) , high pressure , metallurgy , composite material , engineering , engineering physics , nanotechnology
Thank you very much; I am bharat sharma founder of steady die casting solutions. This time I have found one more solution for biscuit thickness validation in high pressure die casting. In this paper we will discuss, what is biscuit thickness?, why we need to identify right biscuit thickness?, how we can validate right biscuit thickness? and effect of biscuit thickness variation. This paper is all about to clear all myth to calculate biscuit thickness in high pressure die casting. This is very serious business when we are calculating biscuit thickness to avoid casting defect. Through this paper I would like to share this knowledge and I hope it will helpful to others. “Keep learning till death “. Keywords: (Biscuit thickness, plunger, hpdc, die casting, casting defect, solidification)