Open AccessThin film Deposition Methods: A Critical Review
Author(s) -
Mandakini N. Chaudhari
Publication year - 2021
Publication title -
international journal for research in applied science and engineering technology
Language(s) - English
Resource type - Journals
ISSN - 2321-9653
DOI - 10.22214/ijraset.2021.36154
Subject(s) - thin film , combustion chemical vapor deposition , deposition (geology) , chemical vapor deposition , materials science , physical vapor deposition , carbon film , nanotechnology , hybrid physical chemical vapor deposition , vapour deposition , chemical engineering , computer science , engineering , geology , paleontology , sediment
The aim of this review paper is to present a critical analysis of existing methods of thin film deposition. Paper discusses some thin film techniques which are advanced and popular. The advantages and disadvantages of each method are mentioned. The two major areas of interest discussed are physical and chemical vapor deposition techniques. In general, thin film is a small thickness that produces by physical vapour deposition (PVD) and chemical vapour deposition (CVD). Despite the PVD technique has a few drawbacks, it remains an important method and more beneficial than CVD technique for depositing thin films materials. It is examined that some remarkable similarities and difference between the specific methods. The sub methods which are having common principle are classified. The number of researchers attempted to explain the how the specific method is important and applicable for the deposition of thin films. In conclusion the most important method of depositing thin films is CVD. For our research work the Spray Pyrolysis technique, which is versatile and found suitable to use.