Open AccessA Review on Electrically Conductive Adhesives in Electronic Packaging
Author(s) -
Kevin George
Publication year - 2021
Publication title -
international journal for research in applied science and engineering technology
Language(s) - English
Resource type - Journals
ISSN - 2321-9653
DOI - 10.22214/ijraset.2021.34685
Subject(s) - adhesive , electrical conductor , electrically conductive , materials science , composite material , layer (electronics)