Open AccessTo Investigate the Thermal and Mechanical Properties of Bismuth-Doped SAC Solder
Author(s) -
Nasir Akbar
Publication year - 2019
Publication title -
international journal for research in applied science and engineering technology
Language(s) - English
Resource type - Journals
ISSN - 2321-9653
DOI - 10.22214/ijraset.2019.8006
Subject(s) - bismuth , soldering , materials science , doping , thermal , composite material , metallurgy , optoelectronics , thermodynamics , physics