Open AccessDelay and Power Analysis of Three Coupled through Silicon Vias in 3D ICs
Author(s) -
Vishnu Vardhan Reddy Mudireddy
Publication year - 2019
Publication title -
international journal for research in applied science and engineering technology
Language(s) - English
Resource type - Journals
ISSN - 2321-9653
DOI - 10.22214/ijraset.2019.5551
Subject(s) - three dimensional integrated circuit , materials science , power (physics) , silicon , power analysis , electrical engineering , optoelectronics , integrated circuit , engineering , physics , quantum mechanics
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