Open AccessAn efficient 3D Diffie-Hellman based Two-Server password-only authenticated key exchange
Author(s) -
Anitha Kumari K,
G. Sudha Sadasivam
Publication year - 2019
Publication title -
journal of applied research and technology
Language(s) - English
Resource type - Journals
ISSN - 2448-6736
DOI - 10.22201/icat.16656423.0.16.1.698
Subject(s) - authenticated key exchange , password , computer science , key exchange , computer security , protocol (science) , server , key agreement protocol , authentication (law) , computer security model , key (lock) , computer network , encryption , public key cryptography , key distribution , medicine , alternative medicine , pathology
In emerging technological world, security potentially remains as a highest challenge in the large-scale distributed systems, as it is suffering extensively with adversarial attacks due to insufficient mutual authentication. In order to address this, a state-of-art tetrahedron (3D) based two-server Password Authenticated and Key Exchange (PAKE) protocol has been formulated with formal proof of security by incorporating the elementary properties of plane geometry. The main intention of this work is, obtaining a password from the stored credentials must be infeasible when both the servers compromised together. At the outset to realize these goals, in this paper, the properties of the tetrahedron are utilized along with Diffie-Hellman (DH) key exchange algorithm to withstand against malicious attacks. A significant aspect of the proposed 3D PAKE protocol is, client side complexity has been reduced to a greater extent in terms of computation and communication. Both theoretically and practically, 3D PAKE protocol is the first demonstrable secure two-server PAKE protocol that breaks the assumptions of the Yang et al. and Yi et al. protocol that the two servers must not compromise together. Computational complexity, communication complexity, security key principles, best of all attacks happening dubiously are considered as the evaluation parameters to compare the performance of the proposed 3D PAKE protocol.