Open AccessОстаточные напряжения в несущей ленте AISI 310S на этапе нанесения буферного слоя YSZ при изготовлении ВТСП-2 провода
Author(s) -
A. V. Irodova,
I. D. Karpov,
V. S. Kruglov,
V. E. Krylov,
S. V. Shavkin,
В. Т. Эм
Publication year - 2021
Publication title -
žurnal tehničeskoj fiziki
Language(s) - English
Resource type - Journals
eISSN - 1726-748X
pISSN - 0044-4642
DOI - 10.21883/jtf.2021.12.51761.169-21
Subject(s) - materials science , residual stress , polishing , yttria stabilized zirconia , composite material , layer (electronics) , deposition (geology) , ultimate tensile strength , stress (linguistics) , metallurgy , cubic zirconia , ceramic , paleontology , linguistics , philosophy , sediment , biology
Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 μm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight distension of the tape in the rolling plane. After the deposition of the YSZ layer, uniform tensile stress of 70 MPa isotropic in the rolling plane was observed inside the tape. Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. It is assumed that the surface of the tape is plastically deformed during the YSZ deposition.