Open AccessФормирование интерметаллида Cu-=SUB=-6-=/SUB=-Sn-=SUB=-5-=/SUB=- в тонких пленках Cu/Sn
Author(s) -
Л. Е. Быкова,
Sergey Zharkov,
В.Г. Мягков,
Ю.Ю. Балашов,
Г. С. Патрин
Publication year - 2021
Publication title -
fizika tverdogo tela
Language(s) - English
Resource type - Journals
eISSN - 1726-7498
pISSN - 0367-3294
DOI - 10.21883/ftt.2021.12.51685.139
Subject(s) - intermetallic , materials science , electron diffraction , transmission electron microscopy , thin film , phase (matter) , crystallography , bilayer , grain boundary , diffraction , atmospheric temperature range , diffusion , electron microscope , hexagonal crystal system , analytical chemistry (journal) , metallurgy , condensed matter physics , microstructure , chemistry , thermodynamics , nanotechnology , optics , biochemistry , physics , organic chemistry , alloy , chromatography , membrane
The study of the formation of the Cu6Sn5 intermetallic compound in Sn(55nm)/Cu(30nm) thin bilayer films was carried out directly in the column of a transmission electron microscope (electron diffraction mode) by heating the film sample from room temperature to 300 °C and recording the electron diffraction patterns. The thin films formed as a result of a solid state reaction were monophase and consisted of the η-Cu6Sn5 hexagonal phase. The temperature range for the formation of the η-Cu6Sn5 phase was determined. The estimate of the effective interdiffusion coefficient of the reaction suggests that the main mechanism for the formation of the Cu6Sn5 intermetallic is diffusion along the grain boundaries and dislocations.