Термоэдс тонких пленок Bi-=SUB=-1-x-=/SUB=-Sb-=SUB=-x-=/SUB=- (0≤ x≤0.15) на подложках из слюды и полиимида в температурном интервале 77-300 K

This report presents the results of the study of thermoelectricpower of the thin block films of Bi1−xSbx (0 ≤ x ≤ 0.15)with the thickness of 100−1000 nm on the mica and polyimidesubstrates in the temperature range 77−300 K. The appliedtechnique for measuring thermoelectric power allows to preventthe additional film deformation due to the difference in the thermalexpansion of the sample in question and measurement cell. Thestructure, temperature dependences of the thermopower and theresistivity of thin films were analyzed, and the power factor wasestimated. A difference was found in the nature of the temperaturedependences of the thermopower and the specific resistanceof films on mica and polyimide substrates. This difference isexplained by the change of the band structure parameters under theinfluence of film deformation due to the difference in the thermalexpansion of the film and substrate.