z-logo
open-access-imgOpen Access
Терморезистивный полупроводниковый SiC/Si-композиционный материал
Author(s) -
S. K. Brantov,
Е. Б. Якимов
Publication year - 2019
Publication title -
fizika i tehnika poluprovodnikov
Language(s) - English
Resource type - Journals
eISSN - 1726-7315
pISSN - 0015-3222
DOI - 10.21883/ftp.2019.02.47104.8962
Subject(s) - materials science , thermistor , silicon carbide , foil method , silicon , composite material , crystallite , layer (electronics) , thermal , carbon fibers , composite number , atmospheric temperature range , polycrystalline silicon , optoelectronics , metallurgy , electrical engineering , physics , meteorology , engineering , thin film transistor
A new method for growing a layer of self-bonded silicon-carbide crystallites on the surface of a flexible carbon foil with subsequent impregnation of the formed structures by silicon melt is developed. Thermistors for a temperature range of 900–1450 K with s thermal sensitivity attaining 11 350 K able to be used in air are fabricated based on this composite material. The structural and electrophysical characteristics of the mentioned material are investigated.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here