Open AccessOPTIMIZATION OF CONDITION ION Cu2+ ELECTRODEPOSITION IN ELECTROPLATING LIQUID WASTE WITH FORMALDEHYDE AS REDUCING AGENT
Author(s) -
Siti Marwati,
Regina Tutik Padmaningrum
Publication year - 2017
Publication title -
jurnal sains dasar
Language(s) - English
Resource type - Journals
eISSN - 2443-1273
pISSN - 2085-9872
DOI - 10.21831/jsd.v5i1.12670
Subject(s) - formaldehyde , electroplating , absorption (acoustics) , chemistry , reducing agent , atomic absorption spectroscopy , materials science , nuclear chemistry , composite material , organic chemistry , layer (electronics) , physics , quantum mechanics
The aims of this research to determine of the optimum of formaldehyde concentration, teh optimum of electrodeposition time and the optimum pH of solution. In addition, this research also aims to determine the character Cu deposite at optimum operational. The sample in this research was used real electroplating liquid waste from Kotagede Yogyakarta.done at various formaldehyde concentration Electrodeposition was done at various formaldehyde concentration, electrodeposition time and varoius of pH. The optimum conditions could be seen the maximum efficiency. It could be obtained by measuring the final concentration of Cu2+ after electrodeposition process by Atomic absorption spectrophotometry. The character of deposit could be seen by visual and X-ray Diffraction. The result of this research showed that the optimum of formaldehyde concentration as reducing agent was 0.3 M. the optimum time was 4 hours and the optimum of pH 9. The character of deposte was contained Cu deposite and more subtle than deposite which electrodeposited without formaldehyde. Keywords: electrodeposition, formaldehyde, reducing agent