Open AccessINTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP
Author(s) -
Т. А. Исмаилов,
H. M. Gadjiyev,
Т. А. Челушкина,
Д. А. Челушкин
Publication year - 2014
Publication title -
vestnik dagestanskogo gosudarstvennogo tehničeskogo universiteta. tehničeskie nauki
Language(s) - English
Resource type - Journals
eISSN - 2542-095X
pISSN - 2073-6185
DOI - 10.21822/2073-6185-2014-32-1-7-15
Subject(s) - heat sink , thermoelectric effect , materials science , thermoelectric cooling , heat pump , heat transfer , thermoelectric generator , semiconductor , thermoelectric materials , chip , optoelectronics , engineering physics , nuclear engineering , mechanical engineering , mechanics , thermodynamics , electrical engineering , heat exchanger , engineering , physics