z-logo
open-access-imgOpen Access
Deep Trek High Temperature Electronics Project
Author(s) -
Bruce Ohme
Publication year - 2007
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/923033
Subject(s) - electronics , silicon on insulator , eeprom , engineering , field programmable gate array , wafer , amplifier , electrical engineering , computer science , engineering physics , silicon , materials science , optoelectronics , embedded system , cmos
This report summarizes technical progress achieved during the cooperative research agreement between Honeywell and U.S. Department of Energy to develop high-temperature electronics. Objects of this development included Silicon-on-Insulator (SOI) wafer process development for high temperature, supporting design tools and libraries, and high temperature integrated circuit component development including FPGA, EEPROM, high-resolution A-to-D converter, and a precision amplifier

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom