Open AccessMaterials Reliability Program: Development of a New Process for Calculating RPV Heat-Up and Cool-Down Curves - Proof of Concept
Author(s) -
Mark T. EricksonKirk
Publication year - 2005
Language(s) - English
Resource type - Reports
DOI - 10.2172/841932
Subject(s) - reliability (semiconductor) , process (computing) , proof of concept , fracture toughness , heat flow , reliability engineering , fracture (geology) , engineering , mechanical engineering , computer science , nuclear engineering , materials science , thermal , composite material , thermodynamics , physics , power (physics) , operating system , geotechnical engineering
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