LOW TEMPERATURE CATHODE SUPPORTED ELECTROLYTES

This project has three main goals: Thin Films Studies, Preparation of Graded Porous Substrates and Basic Electrical Characterization and testing of Planar Single Cells. In this portion of study we have focused on producing YSZ films on porous LSM substrates. When using the polymer precursor there are a number of obstacles to overcome in order to form dense electrolyte layers on porous substrates (cathode or anode). Probably the most difficult problems are: (1) Extreme penetration of the polymer into the substrate must be prevented. (2) Shrinkage cracking must be avoided. (3) Film thickness in the 1 to 5{micro}m range must be achieved. We have demonstrated that cracking due to shrinkage involved during the elimination of solvents and organic matter and densification of the remaining oxide is not a problem as long as the resulting oxide film is < {approx} 0.15 {micro}m in thickness. We have also shown that we can make thicker films by making multiple depositions if the substrate is smooth (roughness {le} 0.1 {micro}m) and contains no surface pores > 0.2 {micro}m. The penetration of the polymer into the porous substrate can be minimized by increasing the viscosity of the polymer and reducing the largest pore at the surface of the substrate to {le} 0.2 {micro}m. We have shown that this can be done, but we have also shown that it is difficult to make dense films that are defect free with areas > 1 cm{sup 2}. This is because of the roughness of the substrate and the difficulty in making a substrate which does not have surface voids > 0.2 {micro}m. Thus the process works well for dense, smooth substrates for films < 1 {micro}m thick, but is difficult to apply to rough, porous surfaces and to make film thickness > 1 {micro}m. As a result of these problems, we have been addressing the issue of how to make dense films in the thickness range of 1 to 5 {micro}m on sintered porous substrates without introducing cracks and holes due to shrinkage and surface voids? These endeavors have lead us to a solution which we think is quite unique and should allow us to obtain flaw free dense films of thickness in the 0.5 to 5 {micro}m range at processing temperatures {le} 900{sup o}. The process involves the deposition of a slurry of nanocrystalline YSZ onto a presintered porous LSM substrate. The key element in the deposition is that the slurry contains sufficient YSZ polymer precursor to allow adhesion of the YSZ particles to each other and the surface after annealing at about 600 C. This allows the formation of a porous film of 0.5 to 5 {micro}m thick which adheres to the surface. After formation of this film, YSZ polymer precursor is allowed to impregnate the porous surface layer (capillary forces tend to confine the polymer solution in the nanoporous layer). After several impregnation/heat treatment cycles, a dense film results. Within the next few months, this process should be developed to the point that single cell measurements can be made on 0.5 to 5 {micro}m films on a LSM substrate. This type of processing allows the formation of essentially flaw free films over areas > 1 cm{sup 2}