Open AccessFace-up bonding of beam lead devices
Author(s) -
A. Bendure,
Walter N. Piper
Publication year - 1976
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/7349318
Subject(s) - soldering , materials science , indium , substrate (aquarium) , optoelectronics , ceramic , thermal management of electronic devices and systems , tin , lead (geology) , beam (structure) , composite material , metallurgy , mechanical engineering , structural engineering , engineering , oceanography , geomorphology , geology
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