Open AccessAn alternate interconnect method for joining flexible circuits using conductive adhesives
Author(s) -
W. Schurman
Publication year - 1990
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/7031833
Subject(s) - adhesive , materials science , interconnection , electrical conductor , detonator , composite material , adhesive bonding , thermal shock , printed circuit board , electronic circuit , voltage , thermal , optoelectronics , electrical engineering , computer science , engineering , layer (electronics) , computer network , chemistry , physics , organic chemistry , meteorology , explosive material
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