Open Access(Use of lead-tin and tin-silver solders for edge clip attachment on polyimide-quartz circuit)
Publication year - 1990
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/6900821
Subject(s) - soldering , materials science , tin , interconnection , drop test , polyimide , metallurgy , composite material , temperature cycling , printed circuit board , joint (building) , metal , thermal , layer (electronics) , structural engineering , electrical engineering , computer science , engineering , computer network , physics , meteorology
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