Open AccessFinite-element-method study of stresses on simulated electronic components encapsulated in polystyrene-bead foam
Author(s) -
Gregory R. Swanson
Publication year - 1981
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/6826705
Subject(s) - bead , polystyrene , finite element method , materials science , composite material , rotational symmetry , soldering , nonlinear system , stress (linguistics) , structural engineering , electronic component , mechanics , mechanical engineering , engineering , polymer , physics , linguistics , philosophy , quantum mechanics
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