Open AccessProperties of polystrene bead foam as an encapsulant for electronic packages. Final report
Author(s) -
D.J. Fossey
Publication year - 1981
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/6589652
Subject(s) - polystyrene , electronic component , materials science , composite material , penetration (warfare) , mechanical engineering , mathematics , polymer , engineering , operations research
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