Open AccessPolymer processing for thin bondline cladding
Author(s) -
Fung-Ming Kong,
J.K. Lepper
Publication year - 1986
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/6362315
Subject(s) - cladding (metalworking) , materials science , polymer , metering mode , amplifier , composite material , curing (chemistry) , laser , thin film , optics , optoelectronics , nanotechnology , cmos , physics
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