Open AccessA test system for thermomechanical fatigue of solder joints
Author(s) -
D.T. Schmale,
D. R. Frear
Publication year - 1989
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/6055614
Subject(s) - soldering , materials science , reliability (semiconductor) , direct shear test , thermal fatigue , shear (geology) , microstructure , shear stress , metallurgy , stress (linguistics) , strain (injury) , composite material , structural engineering , thermal , engineering , medicine , power (physics) , linguistics , physics , philosophy , quantum mechanics , meteorology
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