Open AccessEvaluation of the technical feasibility and effective cost of various wafer thicknesses for the manufacture of solar cells. Final report, July 15, 1978-July 15, 1979
Author(s) -
Not Given Author
Publication year - 1980
Language(s) - English
Resource type - Reports
DOI - 10.2172/5381052
Subject(s) - slicing , wafer , abrasive , materials science , breakage , wafer dicing , silicon , ingot , etching (microfabrication) , composite material , optoelectronics , optics , mechanical engineering , engineering , physics , alloy , layer (electronics)
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