Open AccessSilicon dendritic-web material process development. Final report
Author(s) -
D.L. Meier,
R. B. Campbell,
Łukasz Sienkiewicz,
P. RaiChoudhury
Publication year - 1982
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/5356703
Subject(s) - copper , electroplating , materials science , silicon , titanium , layer (electronics) , electrical contacts , nickel , contact resistance , metallurgy , composite material
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