Open AccessAdhesive for composite bonding
Author(s) -
Richard E. Lyon,
C.M. Walkup,
John C. Matthews
Publication year - 1989
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/5211026
Subject(s) - adhesive , composite material , materials science , composite number , wetting , epoxy , shearing (physics) , adhesive bonding , composite epoxy material , layer (electronics)
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