Thin-film microcircuit substrate metallization. Final report
Author(s) -
N V Forte
Publication year - 1973
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/4357806
Subject(s) - materials science , tantalum , substrate (aquarium) , optoelectronics , layer (electronics) , thin film , nitride , lead frame , tantalum nitride , wire bonding , nanotechnology , metallurgy , semiconductor device , electrical engineering , chip , oceanography , engineering , geology
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