Open AccessEffects of bonding bakeout thermal cycles on pre- and post irradiation microstructures, physical, and mechanical properties of copper alloys
Author(s) -
B. N. Singh,
M. Eldrup,
P. Toft,
Danny J. Edwards
Publication year - 1996
Language(s) - English
Resource type - Reports
DOI - 10.2172/414878
Subject(s) - materials science , microstructure , copper , metallurgy , ultimate tensile strength , alloy , irradiation , precipitation hardening , composite material , nuclear physics , physics
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