High temperature mechanical performance of a hot isostatically pressed silicon nitride
Author(s) -
Andrew A. Wereszczak,
Mattison K. Ferber,
M.G. Jenkins,
Chin-Ho Lin
Publication year - 1996
Language(s) - English
Resource type - Reports
DOI - 10.2172/226431
Subject(s) - silicon nitride , materials science , nitride , ceramic , creep , silicon , thermal shock , hot isostatic pressing , mechanical engineering , composite material , metallurgy , alloy , engineering , layer (electronics)
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