Open AccessCorrelating Incident Heat Flux and Source Temperature to Meet Astm E1529 Requirements for Ram Packaging Components Thermal Testing- Summary.
Author(s) -
Austin Baird,
Walter Gill,
Hector Mendoza,
Victor Figueroa
Publication year - 2021
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Conference proceedings
DOI - 10.2172/1869764
Subject(s) - heat flux , flux (metallurgy) , mechanical engineering , task (project management) , plasma , nuclear engineering , engineering , materials science , heat transfer , systems engineering , nuclear physics , metallurgy , thermodynamics , physics
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