Defect Kinetics and Control for Module Reliability
Author(s) -
Mariana I. Bertoni,
David P. Fenning
Publication year - 2020
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1844430
Subject(s) - wafer , reliability engineering , stacking , reliability (semiconductor) , robustness (evolution) , materials science , degradation (telecommunications) , computer science , electronic engineering , engineering , nanotechnology , chemistry , power (physics) , physics , biochemistry , organic chemistry , quantum mechanics , gene
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