Open AccessUnderstanding and Overcoming Water-induced Interfacial Degradation in Si Modules (Final Technical Report)
Author(s) -
David P. Fenning,
Rishi E. Kumar,
Guillaume von Gastrow,
Mariana I. Bertoni,
April M. Jeffries,
Nicholas Theut,
Maria K. Y. Chan,
Arun Mannodi Kanakkithodi
Publication year - 2021
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/1773388
Subject(s) - durability , moisture , humidity , water content , materials science , degradation (telecommunications) , reflectometry , composite material , chemical engineering , environmental science , process engineering , computer science , meteorology , geotechnical engineering , telecommunications , engineering , time domain , physics , computer vision
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