Open AccessEvaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys
Author(s) -
Rebecca Wheeling,
Paul T. Vianco,
Shelley Williams
Publication year - 2020
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1763529
Subject(s) - solderability , soldering , materials science , metallurgy , tin , wetting , copper , foil method , bismuth , composite material
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom