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TRUST-EABM Contact Thermal Conductance (CTC) Report
Author(s) -
Thomas LeBrun,
Kyle Brindley
Publication year - 2021
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/1760545
Subject(s) - testbed , thermal contact conductance , finite element method , thermal , thermal conductivity , computer science , conductance , contact resistance , joint (building) , simulation , thermal resistance , materials science , engineering , physics , nanotechnology , structural engineering , computer network , thermodynamics , composite material , layer (electronics) , condensed matter physics

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