Open AccessTest Plan to Investigate the Optimal Cure Schedule of an Epoxy Resin for Its Application as an Adhesive in Optocouplers
Author(s) -
Lauren Naatz
Publication year - 2020
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1659161
Subject(s) - epoxy , adhesive , schedule , materials science , epoxy adhesive , differential scanning calorimetry , composite material , aerospace , electronics , automotive industry , thermal , computer science , chemistry , engineering , physics , layer (electronics) , meteorology , thermodynamics , aerospace engineering , operating system
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