Open AccessLow Cost (CAPEX and variable): Tool design for cell and module fabrication with thin, free-standing silicon wafers
Author(s) -
Zhe Liu,
Sara Bonner,
Tonio Buonassisi,
Emanuel M. Sachs
Publication year - 2020
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1618395
Subject(s) - wafer , wafer testing , wafer dicing , wafer backgrinding , materials science , silicon , fabrication , wafer level packaging , enhanced data rates for gsm evolution , optoelectronics , electronic engineering , computer science , engineering , telecommunications , medicine , alternative medicine , pathology
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom