Open AccessHPC4Mfg with Samsung: Making semiconductor devices cool through HPC ab initio simulations
Author(s) -
LinWang Wang
Publication year - 2020
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1617376
Subject(s) - interconnection , ab initio , semiconductor , preconditioner , scattering , computer science , semiconductor device , electronic engineering , computational physics , materials science , computational science , physics , optoelectronics , nanotechnology , engineering , algorithm , quantum mechanics , telecommunications , iterative method , layer (electronics)
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