Open AccessModeling adhesive debonding using the shim layer modeling approach
Author(s) -
Ralph Stevens
Publication year - 2019
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1571581
Subject(s) - adhesive , anodizing , oxide , materials science , interphase , interlock , composite material , hydrogen bond , layer (electronics) , fluoride , hydrofluoric acid , structural engineering , chemistry , inorganic chemistry , metallurgy , molecule , aluminium , engineering , organic chemistry , biology , genetics
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