Open AccessAdhesion, microstructure and electrical resistance of sputtered Cu films on alumina substrates [Slide]
Author(s) -
Igor Usov,
David Waschezyn,
Douglas Vodnik,
R. Ryan Waked,
Michael R. Middlemas,
Matthew M. Schneider,
T. G. Holesinger
Publication year - 2019
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1569566
Subject(s) - microstructure , materials science , perpendicular , substrate (aquarium) , diffraction , surface finish , long axis , scanning tunneling microscope , composite material , surface roughness , condensed matter physics , crystallography , optics , chemistry , nanotechnology , geometry , geology , oceanography , mathematics , physics
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