Open AccessInsulation Resistance of Flat Flexible Circuit Boards
Author(s) -
Joseph Cordaro,
Troy Dillinger
Publication year - 2016
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1561692
Subject(s) - polyimide , copper , printed circuit board , materials science , composite material , substrate (aquarium) , adhesive , optoelectronics , electrical engineering , metallurgy , layer (electronics) , engineering , oceanography , geology
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom